Optical element driving mechanism

ABSTRACT

A driving mechanism is provided and configured to drive an optical element. The driving mechanism includes a base unit, a holding unit, a driving assembly, a sensing assembly, and a first circuit component. The holding unit is configured to hold an optical element that has an optical axis. The driving assembly is configured to drive the optical element to move relative to the base unit. The sensing assembly is configured to detect the movement of the holding unit relative to the base unit. The first circuit component is disposed in the base unit and electrically connected to the sensing assembly, wherein the first circuit component extends in a direction that is substantially parallel to the optical axis.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of application Ser. No. 15/935,512,filed Mar. 26, 2018, which claims the benefit of U.S. ProvisionalApplication No. 62/478,193, filed Mar. 29, 2017, and claims priority ofChina Patent Application No. 201810185975.4, filed Mar. 7, 2018, theentirety of which are incorporated by reference herein.

BACKGROUND Technical Field

The disclosure relates to an optical element driving mechanism, and inparticular to an optical element driving mechanism in which the elasticelement and the sensing assembly at least partially overlap whenobserved in the optical axis direction.

Description of the Related Art

The volume requirements on electronic products are becoming increasinglystricter. If the overall volume needs to be reduced, the interior spacehas to be utilized more effectively. In addition, when electronicproducts collide with one another, inner electronic elements can oftenbecome damaged due to the collision with other components. Therefore,the performance of these electronic products suffers.

BRIEF SUMMARY

For solving the aforementioned problems, some embodiments of thedisclosure provide a driving mechanism configured to drive an opticalelement. The driving mechanism includes a holding unit, a base unit, anelastic element, a driving assembly, and a sensing assembly. The holdingunit is configured to hold the optical element. The base unit is locatedbelow the holding unit. The elastic element connects the holding unit tothe base unit. The driving assembly is configured to drive the opticalelement to move relative to the base unit. The sensing assembly isdisposed between the holding unit and the base unit, and the sensingassembly is configured to detect the position of the holding unitrelative to the base unit. When observed in an optical axis direction ofthe optical element, the elastic element and the sensing assembly atleast partially overlap.

In an embodiment, the sensing assembly further includes a magnetic fieldsensing element disposed on the base unit, and a sensing magnet disposedon the holding unit. In an embodiment, the sensing magnet is amultipolar magnet. In an embodiment, the driving mechanism furtherincludes a housing, which is a magnetic permeable material, having anopening and an extending portion. The holding unit is disposed in theopening, and the extending portion extends from an inner edge of theopening towards the base unit. In an embodiment, the housing has arectangular structure, and the extending portion and the sensingassembly are located at different corners of the rectangular structure.In an embodiment, the housing further includes two extending portions,which are respectively located at two opposite corners of therectangular structure.

Some embodiments of the disclosure provide a driving mechanismconfigured to drive an optical element. The driving mechanism includes aframe, a holding unit, a driving assembly, and a circuit unit. The frameincludes a stopping portion protruding from an inner surface of theframe, wherein there is a first distance between the stopping portionand an optical axis of the optical element. The holding unit is movablydisposed in the frame, and is configured to hold the optical element.The driving assembly is configured to drive the optical element to moverelative to the frame. The circuit unit is disposed on the frame,wherein there is a second distance between the circuit unit and theoptical axis of the optical element, and the first distance is shorterthan the second distance.

In an embodiment, the circuit unit includes a circuit board and anintegrated circuit element, the integrated circuit element is disposedon the circuit board, wherein the integrated circuit element abuts anabutting surface of the stopping portion. In an embodiment, the abuttingsurface is perpendicular to the optical axis direction. In anembodiment, the stopping portion has a C-shaped structure. In anembodiment, the circuit unit includes a circuit board and an integratedcircuit element, and the integrated circuit element is disposed on thecircuit board, wherein the frame further includes two limiting portions.The circuit board is disposed between the limiting portions for limitingthe circuit board at a given position. In an embodiment, the circuitunit includes the circuit board and the integrated circuit element, andthe integrated circuit element is disposed on the circuit board, whereinthe stopping portion and the limiting portions form a recess, and thecircuit board is disposed in the recess. In an embodiment, the drivingmechanism further includes a wire, wherein the holding unit includes awire pillar. The wire is electrically connected to the driving assembly,and winds around the wire pillar, wherein the wire pillar and thedriving assembly respectively correspond to different sides of theholding unit.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a schematic perspective view illustrating a driving mechanismin accordance with an embodiment of the present disclosure.

FIG. 2 is an exploded view illustrating the driving mechanism in FIG. 1.

FIG. 3A is a cross-sectional view illustrating the driving mechanismalong line A-A′ in FIG. 1.

FIG. 3B is a cross-sectional view illustrating the driving mechanismalong line B-B′ in FIG. 1.

FIG. 4 is a top view illustrating the driving mechanism in accordancewith an embodiment of the present disclosure.

FIG. 5 is a schematic view illustrating a magnetic field sensing elementand a sensing magnet in accordance with an embodiment of the presentdisclosure after assembly.

FIG. 6A is a partial top view illustrating relative positions between adriving coil, an upper leaf spring, a lower leaf spring, a magneticfield sensing element, and a sensing magnet in accordance with anembodiment of the present disclosure after assembly.

FIG. 6B is a side view illustrating relative positions between thedriving coil, the upper leaf spring, the lower leaf spring, the magneticfield sensing element, and the sensing magnet shown in FIG. 6A afterassembly.

FIG. 7 is a perspective view illustrating relative positions between thehousing, the base unit, and the sensing magnet in accordance with anembodiment of the present disclosure.

FIG. 8A is a side view illustrating the frame and the circuit unit inaccordance with another embodiment of the present disclosure.

FIG. 8B is a top view illustrating the frame and the circuit unit shownin FIG. 8A.

FIG. 8C is a partial cross-sectional view illustrating the frame, thecircuit unit shown in FIG. 8B and the housing after assembly.

DETAILED DESCRIPTION OF THE INVENTION

The driving mechanisms of some embodiments of the present disclosure aredescribed in the following description. However, it should beappreciated that the following detailed description of some embodimentsof the disclosure provides various concepts of the present disclosurewhich may be performed in specific backgrounds that can vary widely. Thespecific embodiments disclosed are provided merely to clearly describethe usage of the present disclosure by some specific methods withoutlimiting the scope of the present disclosure.

Unless defined otherwise, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It shouldbe appreciated that, in each case, the term, which is defined in acommonly used dictionary, should be interpreted as having a meaning thatconforms to the relative skills of the present disclosure and thebackground or the context of the present disclosure, and should not beinterpreted in an idealized or overly formal manner unless so defined inthe present disclosure.

Referring to FIGS. 1 to 3B, wherein FIG. 1 is a schematic perspectiveview illustrating a driving mechanism 1 in accordance with an embodimentof the present disclosure, FIG. 2 is an exploded view illustrating thedriving mechanism 1 in FIG. 1, FIG. 3A is a cross-sectional viewillustrating the driving mechanism 1 along line A-A′ in FIG. 1, and FIG.3B is a cross-sectional view illustrating the driving mechanism 1 alongline B-B′ in FIG. 1. It should be noted that, in this embodiment, thedriving mechanism 1 may be, for example, a voice coil motor (VCM), whichmay be disposed in the electronic devices with camera function fordriving an optical lens, and can perform an auto-focusing (AF) function.

It is shown in FIG. 2 that the driving mechanism 1 has a substantialrectangular structure, which mainly includes a housing 10, a base unit20, a holding unit 30, a plurality of driving coils 40, a frame 50, aplurality of magnetic elements 60, an upper leaf spring 70, a lower leafspring 72, a circuit board 80, and at least one sensing magnet 90. Itshould be noted that the term “elastic element” may include the upperleaf spring 70 and/or the lower leaf spring 72 hereinafter.

The housing 10 has a hollow structure, which includes a top wall 10A,four sidewalls 10B, and an opening 12. The center of the opening 12corresponds to an optical axis O of an optical element OE (See FIGS. 3Aand 3B). An opening 22 is formed on the base unit 20, and the opening 22corresponds to an image-sensing element (not shown) disposed outside theoptical element driving mechanism 1. The housing 10 is connected to thebase unit 20. Therefore, the optical element OE (such as an opticallens) disposed in the driving mechanism 1 can perform a focusingfunction with the image-sensing element in the direction of the opticalaxis O. It should be noted that the term “the direction of the opticalaxis O”, which may also be referred to as “the optical axis Odirection”, means the direction that is along the optical axis O orparallel to the optical axis O in the following description.

The base unit 20 includes a body 201 and a connecting member 202. Forexample, the body 201 is a plastic material, and the connecting member202 is a metallic material. In this embodiment, the connecting member202 is electrically connected to a driving unit (not shown) disposedoutside the driving mechanism 1 through the circuit board 80 (See FIG.3B), and the connecting member 202 is configured to perform anauto-focusing (AF) function. In addition, the body 201, which is aplastic material, covers an outside of the connecting member 202 byinsert molding.

The holding unit 30 holds the optical element OE. The holding unit 30has a hollow structure, and a through hole 32 is formed therein, whereinthe optical element OE (See FIGS. 3A and 3B) is secured in the throughhole 32. The frame 50 has an opening 52, and the frame 50 includes arecess 50A, wherein the circuit board 80 may be fixed in the recess 50A.In this embodiment, the circuit board 80 is electrically connected tothe driving unit (not shown) disposed outside the driving mechanism 1.The circuit board 80 is electrically connected to the driving coils 40through the connecting member 202, and the circuit board 80 transmitsthe electrical signals sent from the driving unit to the driving coils40 to perform an auto-focusing (AF) function.

FIG. 3A is a cross-sectional view illustrating the driving mechanism 1along line A-A′ in FIG. 1. As shown in FIGS. 2 and 3A, the holding unit30 is movably connected to the housing 10 and the base unit 20. To bemore specific, the holding unit 30 may be connected to the frame 50through the upper leaf spring 70, the holding unit 30 may also beconnected to the base unit 20 through the lower leaf spring 72, and theupper leaf spring 70 and the lower leaf spring 72 are metallicmaterials. Therefore, the holding unit 30 is movably suspended betweenthe frame 50 and the base unit 20.

Two magnetic elements 60 and two corresponding driving coils 40, whichare disposed outside the holding unit 30, may constitute a drivingassembly EM. When a current is applied to the driving coils 40 throughthe connecting member 202 and the circuit board 80 (See FIG. 3B), anelectromagnetic driving force may be generated by the driving coils 40and the magnetic elements 60 to drive the holding unit 30 and theoptical element OE to move along Z-axis direction (the optical axis Odirection) relative to the base unit 20. Therefore, the auto-focusing(AF) function is performed.

FIG. 3B is a cross-sectional view illustrating the driving mechanism 1along line B-B′ in FIG. 1. As shown in FIG. 3B, the circuit board 80 maytransmit the electrical signal to the two driving coils 40 (See FIG.3A), which is disposed outside the holding unit 30, through theconnecting member 202, the lower leaf spring 72, and a wire 31.Therefore, the movement of the holding unit 30 in Z-axis direction iscontrolled.

In addition, a magnetic field sensing element 82 may also be disposed onand electrically connected to the circuit board 80. The magnetic fieldsensing element 82 is, for example, a Hall effect sensor, amagnetoresistive (MR) sensor, such as a giant magnetoresistive (GMR)sensor or a tunnel magnetoresistive (TMR) sensor, or a fluxgate. Themagnetic field sensing element 82 and the sensing magnet 90 constitute asensing assembly. By detecting the sensing magnet 90, which is disposedon the holding unit 30, the displacement of the holding unit 30 in theZ-axis direction (the optical axis O direction) relative to the baseunit 20 may be obtained. The circuit board 80 and the driving assemblyEM are disposed on different sides of the driving mechanism 1. That way,electromagnetic interference may be avoided, and the interior space ofthe driving mechanism 1 may be fully utilized.

Referring to FIG. 4, FIG. 4 is a top view illustrating the drivingmechanism 1 in accordance with an embodiment of the present disclosure.For clarity of illustrating inner configuration of the driving mechanism1, the housing 10, the frame 50, and the upper leaf spring 70 are notshown in FIG. 4. As shown in FIG. 4, the driving assembly EM (includingthe magnetic elements 60 and the driving coils 40) is disposed on twoopposite sides of the holding unit 30 (such as the left and right sidesof the holding unit 30 in FIG. 4), and the driving assembly EM is notdisposed on the other sides of the holding unit 30 (such as the upperand lower sides of the holding unit 30 in FIG. 4). Therefore, the sizeof the driving mechanism 1 may be reduced on the sides where no drivingassembly EM is disposed, and the miniaturization effect is achieved.

In addition, the holding unit 30 includes wire pillars 311 for windingthe wires 31, which are electrically connected to the driving coils 40(the driving assembly EM) around the wire pillars 311. It should benoted that the wire pillars 311 and the driving assembly EM are disposedon different sides of the holding unit 30. For example, the wire pillars311 are disposed on the upper and lower sides of the holding unit 30 inFIG. 4 to evade the driving assembly EM. That way, the required space inthe driving mechanism 1 may be further saved.

Still referring to FIG. 4, in this embodiment, not only the magneticfield sensing element 82, but the integrated circuit (IC) element 84 anda capacitor 86 are also disposed on the circuit board 80. The circuitboard 80, the integrated circuit element 84, and the capacitor 86 mayconstitute a circuit unit CU, which is configured to perform anauto-focusing function. The sensing magnet 90 is disposed in acorresponding cavity 910 on the holding unit 30, and the sensing magnet90 may be fixed in the cavity 910 through an adhesive. It should benoted that besides the sensing magnet 90 corresponding to the magneticfield sensing element 82, another sensing magnet 90′ is also disposed onthe opposite place to the sensing magnet 90 on the holding unit 30. Thesensing magnet 90′ is disposed in a corresponding cavity 910′ so thatthe driving mechanism 1 may reach a balance on weight.

Referring to FIG. 5, FIG. 5 is a schematic view illustrating themagnetic field sensing element 82 and the sensing magnet 90 inaccordance with an embodiment of the present disclosure after assembly.In this embodiment, there are no other elements disposed between themagnetic field sensing element 82 and the sensing magnet 90. Therefore,the magnetic field sensing element 82 may detect the displacement of thesensing magnet 90 located on the holding unit 30 in Z-axis direction(the optical axis O direction) without any interference. The detectionaccuracy is enhanced. The sensing magnet 90 is a multipolar magnet,which includes at least two magnetic domains 901 and 903. The magneticdomains 901 and 903 respectively have an N-pole and an S-pole. Moreover,the sensing magnet 90 further includes a magnetic neutral zone 902,which is located between the magnetic domains 901 and 903.

As shown in FIG. 5, the S-pole of the magnetic domain 901 faces themagnetic field sensing element 82, and the N-pole faces the through hole32 (See FIG. 4) of the holding unit 30. The N-pole of the other magneticdomain 903 faces the magnetic field sensing element 82, and the S-polefaces the through hole 32 of the holding unit 30. It should be notedthat, in some other embodiments, the polar directions of the magneticdomains 901 and 903 may be opposite to the aforementioned polardirections. The lines of magnetic field may be closer by designing thesensing magnet 90 as a multipolar magnet with multiple magnetic domains.In a case without increasing the volume of the sensing magnet 90, thedetection accuracy may be further enhanced. That way, the size of thesensing magnet 90 may also be reduced so that the energy consumption ofthe driving mechanism 1 is also reduced, and the miniaturization effectcan be achieved.

Referring to FIGS. 6A and 6B, FIG. 6A is a partial top view illustratingrelative positions between the driving coil 40, the upper leaf spring70, the lower leaf spring 72, the magnetic field sensing element 82, andthe sensing magnet 90 in accordance with an embodiment of the presentdisclosure after assembly, and FIG. 6B is a partial side viewillustrating relative positions between the driving coil 40, the upperleaf spring 70, the lower leaf spring 72, the magnetic field sensingelement 82, and the sensing magnet 90 shown in FIG. 6A after assembly.As shown in FIGS. 6A and 6B, when observed in the optical axis Odirection (Z-axis direction), the magnetic field sensing element 82 andthe sensing magnet 90 (the sensing assembly) are disposed between theupper leaf spring 70 and the lower leaf spring 72, and the sensingassembly, the upper leaf spring 70 and the lower leaf spring 72 (theelastic element) at least partially overlap. In this embodiment, themagnetic field sensing element 82 and the sensing magnet 90 do notexceed the edges of the upper leaf spring 70 and the lower leaf spring72 in a horizontal direction (XY-plane). Therefore, the required spaceof the driving mechanism 1 in the horizontal direction (XY-plane) may befurther saved so that the miniaturization of the driving mechanism isachieved.

Referring to FIG. 7, FIG. 7 is a perspective view illustrating relativepositions between the housing 10, the base unit 20, and the sensingmagnet 90 in accordance with an embodiment of the present disclosureafter assembly. In this embodiment, the housing 10 is a magneticpermeable material with a rectangular structure, wherein the holdingunit 30 is disposed in the opening 12 of the housing 10, and the housing10 includes two extending portions 11 extending from the inner edge ofthe opening 12 towards the base unit 20 (−Z-axis direction). Inaddition, the two extending portions 11 are located at two oppositecorners of the rectangular structure, and the extending portions 11 arelocated at the corners of the rectangular structure, which is differentfrom that of the rectangular structure where the sensing magnet 90 andthe corresponding magnetic field sensing element 82 (i.e. the sensingassembly) (See FIGS. 6A and 6B) are located. That is, the extendingportions 11 and the sensing magnet 90 are disposed at different cornersof the housing 10. The magnetic permeable housing 10 and its extendingportion 11 may be avoided affecting the sensing magnet 90. Therefore,the operation of the driving mechanism is avoided being affected, andthe driving mechanism 1 may reach a balance on weight.

Referring to FIGS. 8A-8C, FIG. 8A is a side view illustrating the frame50 and the circuit unit CU in accordance with another embodiment of thepresent disclosure, FIG. 8B is a top view illustrating the frame 50 andthe circuit unit CU shown in FIG. 8A, and FIG. 8C is a schematiccross-sectional view illustrating the frame 50, the circuit unit CUshown in FIG. 8B and the housing 10 after assembly. In this embodiment,the circuit unit CU is disposed on the frame 50. The frame 50 includes astopping portion 502 and two limiting portions 504. The stopping portion502 protrudes from an inner surface 50B (See FIG. 8B) of the frame 50,and is configured to protect the electronic elements of the circuit unitCU (i.e. the electronic elements disposed on the circuit board 80). Thecircuit board 80 is disposed between the two limiting portions 504,which is configured to limit the circuit board 80 at a given position.That is, the position of the circuit unit CU on the frame 50 is fixed.

In addition, the stopping portion 502 has a C-shaped structure (See FIG.8A) around the integrated circuit element 84 located on the circuitboard 80. The stopping portion 502 has a first width W1 (See FIG. 8C) inY-axis direction, the integrated circuit element 84 has a second widthW2 in Y-axis direction, and the first width W1 is greater than thesecond width W2. In other words, there is a first distance D1 betweenthe stopping portion 502 and the optical axis O of the optical elementOE, and there is a second distance D2 between the integrated circuitelement 84 of the circuit unit CU and the optical axis O, therein thefirst distance D1 is shorter than the second distance D2. That way, thestopping portion 502 may protect the integrated circuit element 84 andother electronic elements (such as the magnetic field sensing element82) disposed on the circuit board 80. Therefore, the electronic elementsmay not be damaged due to direct collision with other components in theoptical element driving mechanism 1.

The stopping portion 502, the limiting portions 504, and the housing 10(See FIG. 8C) constitute a recess 50A. The recess 50A has a width WRbetween the stopping portion 502 and the inner surface of the housing10, wherein the width WR is substantially in a range of about 0.05 mm toabout 0.2 mm, such as 0.1 mm. The circuit board 80 is disposed in therecess 50A, and the circuit board 80 is limited in a given position in ahorizontal direction (XY-plane) so that it is less possible for thecircuit board 80 to be detached. In addition, the stopping portion 502and the limiting portions 504 of the frame 50 may also serve aspositioning targets for mounting the circuit board 80 on the frame 50.Therefore, during assembly, the accuracy of positioning the circuitboard 80 is enhanced, and the assembly difficulty is reduced.

Still referring to FIG. 8C, the stopping portion 502 has an abuttingsurface 502A, which is perpendicular to the optical axis O direction(Z-axis direction). The integrated circuit element 84 disposed on thecircuit board 80 abuts the abutting surface 502A of the stopping portion502, and the circuit board 80 is prevented from contacting the frame 50in a vertical direction (Z-axis direction), leaving a gap between thecircuit board 80 and the frame 50. When the driving mechanism 1 iscollided in a vertical direction, the circuit board 80 may be avoidedfrom becoming damaged due to direct collision with the frame 50.Furthermore, a chamfer 502B may be disposed on an inner side of thestopping portion 502 so that the circuit unit CU may be mounted in therecess 50A more easily.

As set forth above, the embodiments of the present disclosure provide anoptical element driving mechanism in which an elastic element and asensing assembly at least partially overlap when observed in an opticalaxis direction. That way, the interior space may be utilized moreeffectively to reduce the volume of the driving mechanism. In addition,the embodiments of the present disclosure also provide an opticalelement driving mechanism with a frame, which may protect a circuitboard. Therefore, the circuit board may be less damaged due to collisionwith other components.

While the embodiments and the advantages of the present disclosure havebeen described above, it should be understood that those skilled in theart may make various changes, substitutions, and alterations to thepresent disclosure without departing from the spirit and scope of thepresent disclosure. In addition, the scope of the present disclosure isnot limited to the processes, machines, manufacture, composition,devices, methods and steps in the specific embodiments described in thespecification. Those skilled in the art may understand existing ordeveloping processes, machines, manufacture, compositions, devices,methods and steps from some embodiments of the present disclosure. Aslong as those may perform substantially the same function in theaforementioned embodiments and obtain substantially the same result,they may be used in accordance with some embodiments of the presentdisclosure. Therefore, the scope of the present disclosure includes theaforementioned processes, machines, manufacture, composition, devices,methods, and steps. Furthermore, each of the appended claims constructsan individual embodiment, and the scope of the present disclosure alsoincludes every combination of the appended claims and embodiments.

What is claimed is:
 1. A driving mechanism driving an optical element,comprising: a base unit; a holding unit configured to hold an opticalelement having an optical axis; a driving assembly configured to drivethe optical element to move relative to the base unit; a sensingassembly configured to detect the movement of the holding unit relativeto the base unit; and a first circuit component disposed in the baseunit and electrically connected to the sensing assembly, wherein thefirst circuit component extends in a direction substantiallyperpendicular to the optical axis.
 2. The driving mechanism as claimedin claim 1, wherein the first circuit component comprises two connectingportions electrically isolated from each other, and the connectingportions are electrically connected to the sensing assembly.
 3. Thedriving mechanism as claimed in claim 1, further comprising an elasticelement elastically connected to the base unit and the holding unit, andwhen viewed in the optical axis, the sensing assembly and the elasticelement at least partially overlap.
 4. The driving mechanism as claimedin claim 3, wherein the sensing assembly further comprises aposition-sensing element, and when viewed in the optical axis, theposition-sensing element and the elastic element at least partiallyoverlap.
 5. The driving mechanism as claimed in claim 4, wherein thesensing assembly further comprises a sensing magnet corresponding to theposition-sensing element, and the sensing magnet is a multipolar magnet.6. The driving mechanism as claimed in claim 5, wherein the sensingmagnet comprises a plurality of magnetic domains, and a magnetic neutralzone located between the magnetic domains.
 7. The driving mechanism asclaimed in claim 3, wherein when viewed in the optical axis, the drivingassembly and the elastic element at least partially overlap.
 8. Thedriving mechanism as claimed in claim 1, further comprising a secondcircuit component, wherein the first circuit component is electricallyconnected to a driving unit via the second circuit component.
 9. Thedriving mechanism as claimed in claim 8, wherein when viewed in theoptical axis, the first circuit component and the second circuitcomponent at least partially overlap.
 10. The driving mechanism asclaimed in claim 8, wherein the second circuit component is located onone side of the base unit.
 11. The driving mechanism as claimed in claim8, wherein the sensing assembly further comprises a position-sensingelement disposed on the second circuit component.
 12. The drivingmechanism as claimed in claim 11, wherein when viewed in the opticalaxis, the position-sensing element and the first circuit component atleast partially overlap.
 13. The driving mechanism as claimed in claim11, further comprising a frame disposed over the base unit, wherein whenviewed in the optical axis, the position-sensing element is exposed bythe frame.
 14. The driving mechanism as claimed in claim 13, wherein theframe has a stopping portion that protrudes from an inner surface of theframe, and the stopping portion is closer to the optical axis than theposition-sensing element.
 15. The driving mechanism as claimed in claim8, wherein an extending direction of the second circuit component issubstantially perpendicular to an extending direction of the firstcircuit component.
 16. The driving mechanism as claimed in claim 8,wherein the second circuit component and the driving assembly aredisposed on different sides of the base unit.
 17. The driving mechanismas claimed in claim 8, further comprising a housing covering the secondcircuit component, wherein the second circuit component is disposedbetween the housing and the holding unit in a direction perpendicular tothe optical axis.
 18. The driving mechanism as claimed in claim 1,wherein the sensing assembly is electrically connected to the drivingassembly via the first circuit component.
 19. The driving mechanism asclaimed in claim 1, wherein the base unit further comprises a bodywrapping the first circuit component.
 20. The driving mechanism asclaimed in claim 1, wherein when viewed in the optical axis, the drivingassembly and the first circuit component at least partially overlap.